A New Implementation of Multilevel Framework for Interconnect-Driven Floorplanning
نویسندگان
چکیده
for Interconnect-Driven Floorplanning Zheng Xu , Song Chen , Takeshi Yoshimura 1 and Yong Fang 2 1 Graduate School of Information, Production and Systems, Waseda University, Japan Hibikino2-6-317, Wakamatsu, Kitakyushu, Fukuoka 808-0135, Japan 2 School of Communication and Information Engineering, Shanghai University, China Yanchang Road 149, Shanghai 200072, China E-mail: [email protected] Abstract: In this paper, we propose a multilevel fixed-outline floorplanning method, called multilevel IARFP, to deal with floorplanning problem for the large-scale integrated circuit designs. We combine the IARFP [1] into the V-shaped multilevel framework [2], engaging in getting a better result with minimized wirelength. We recursively partition the circuits by using hMetis [3], to get min-cut cost. After the partition stage, we do floorplanning from top to down building sequences for merging and refinement stage. Then we bottom-up merge the sub-regions into big regions until attain the final floorplan. The IARFP is based on Sequence Pair [7] representation; for multilevel case, we present multilevel Sequence Pair representation to handle the floorplanning. We can get about 11% reductions in wirelength within about 55% run time comparing with flat IARFP algorithm.
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